- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Complete PEMS/COTS Upscreening & Qualification
Over 30 years experience upscreening and testing nearly all types of electronic components.
When a military-grade device is made obsolete, designers must scramble to find a replacement to avoid the unwelcome prospect of redesigning the product for a different device. In many cases, there is a readily available commercial off-the-shelf (COTS) version of the same part in the same package that could fill the need—but only if the parts can be shown to meet military-grade temperature requirements. To address this challenge, Micross STS offers upscreening services. Working to customer's specifications, we design a custom workflow using well-maintained, calibrated equipment in our laboratory. The upscreening process identifies COTS that meets customer-specific requirements to serve as replacements for the obsolete devices. The most common situations require testing the device’s mechanical, electrical and environmental properties—all core competencies of Micross STS—to ensure compliance to quality and reliability levels.
Advantages
The usage of COTS PEMs offers many benefits to overcome the challenges of sourcing hi-reliability or custom component solutions. Micross can perform PEMs / COTS Quals on almost all component technologies including:
- FPGAs, Processors, SoC, ASICs, RF and Memory
- Analog and Mixed Signal Devices
- Digital and logic devices
- Discrete Semiconductor and passives plus many others
Ancillary Services to PEM / COTS Screening and Qualification:
- Component Modification: HSD, BGA Reballing
- Alternative paths for failing PEMs
- Bare Die and Wafer Procurement
- Plastic and Hermetic Assembly
- DPA*
*Micross has partnered with Hi-Rel Labs, the premier authority & industry leader in Destructive Physical Analysis (DPA) and Failure Analysis (FA) to provide customers with one complete PEM-Qual solution.
Testing Services
Broad spectrum ATE & Bench test capabilities for processors, memory, FPGAs, communications, high-speed digital, RF, wafer/die and all package types, comprehensive MCM testing, environmental testing
Electrical/Up-screen Testing
Up-screen temperatures ranging from -65C to 225°C